19" Extension Systems, Enclosures and Subracks offer Maximum Flexibility

From computer networking and communications technology via bus and railway technology right up to energy and supply technology, everyday life in industry is determined by electronic control systems. Worldwide, 19” extension systems provide the construction kit for these devices and equipment. For 30 years,  Bopla Gehäuse Systeme (Germany) has supplied this market with 19” subrack and desktop enclosures as well as with metal and plastic enclosures for use in 19“ subracks. Maximum flexibility is ensured with different designs and sizes, and a wide range of accessories.

With its range of Interzoll subracks and series of Interzoll Modul  –  both of which are free from electromagnetic interference – BOPLA offers standardised 19” enclosures. Both series are manufactured from anodised aluminium profiles and are available in four heights, three widths and six depths. Both inside and outside, the dimensions correspond to the 19” standard.

All the components in the Interzoll Modul range correspond to DIN IEC 60297-3-101 / IEEE 1101.1, DIN IEC 60297-3-102 / IEEE 1101.10/11 and DIN IEC 60297-3-103 (insertion/pull-out handles) and have passed the EMC test according to VG 95373 part 15. They have also passed the shock and vibration tests according to German federal railway standard BN 411002 and also IEC 61587-1 , so they can be used in bus and rail vehicles.

The internal and external dimensions of the visually attractive system enclosures in the Internorm Stil and Interzoll Plus series are also designed use with for 19“ subracks. These enclosures can be designed from a choice of two heights, three widths and five depths. Typical applications for these aluminium wall-mounted and desktop enclosures are measurement and control technology and laboratory technology. However, if required, they can also be installed in a switch cabinet. Expansions are possible with the use of additional profiles for PCB technology (.Pi version), screw-on connectors (.12 version), and plug-in units.

The Internorm Stil series is fitted with integrated earth conductor connections, and its standard design offers good electromagnetic screening. This screening can be upgraded with the use of additional EMC components. The series of enclosures can be supplied with or without integrated ventilation and is suitable for Compact PCI and VME 64x applications.

The 19“ system enclosures in the Interzoll Plus series have standardised internal and external dimensions and are based on the BOPLA Interzoll enclosure. The card guide can be locked and unlocked mechanically. This ensures that the snap-in feet do not break off. Various cover plate variants (closed or perforated) complete the system.

The design-oriented Intertego series can be used as both an elegant desktop enclosure and a 19“ subrack. The especially flexible design is characteristic of this metal enclosure with Al Mg Si 0.5 profiles and Z410 zinc-alloy diecast corners. It is available in two heights, three widths and depths, and the lengths and widths can be adapted to meet individual requirements with the addition of profiles. Installation in a 19” cabinet is possible with the use of a special 19” flange panel. The existing standard EMC characteristics can be upgraded by means of suitable accessories.